

ION-IMBREM CCP argon


ION-IMBREM
Capacitive discharge plasma sources for direct plasma processing
Description
The ION IMBREM is a high-frequency capacitive discharge (RF capacitive plasma) source designed for direct plasma processing in thin-film deposition, surface modification, and etching applications, including: Plasma-enhanced chemical vapor deposition (PECVD), Plasma etching and reactive ion etching (RIE), Surface activation, cleaning, and functionalization.The system generates plasma by applying RF power to a flat electrode gas distributor, creating a stable capacitively coupled plasma (CCP) with: Plasma density: 10⁸ – 10¹¹ cm⁻³. Ion energy range: Tens to hundreds of electron volts (eV).
The main advantages
- Precise ion energy control;
- Integrated automatic impedance matching;
- Broad operating pressure range;
- Large uniform plasma area;
- Low contamination.
ION-IMBREM Plasma Source – Technical Specifications
*Other sizes available upon request