Vacuum Process Equipment
IGNIS-A
Universal Desktop Vacuum Coating System
Description
The system is designed for depositing multilayer coatings of dielectric, semiconductor, and conductive materials using RF magnetron sputtering with inductively coupled plasma (ICP) assistance or capacitively coupled plasma (CCP) discharge.
Key Applications of the IGNIS-A Coating System:
• Anti-reflective and optical coatings: SiO₂, Si₃N₄, Nb₂O₅, TiO₂, TiN, Al₂O₃, etc.
• Functional layers for sensors and MEMS devices: In₂O₅, SnO₂, ZnO, etc.
• Biocompatible functional coatings.
• Sample preparation for scanning electron microscopy (SEM).
VTE IGNIS-A - Technical Specifications
Vacuum System:
• Rotary vane pump (pumping speed: 1.5 L/s);
• Turbomolecular pump (pumping speed: 300 L/s for nitrogen);
• Two-stage pumping speed throttling with automatic drive;
• Wide-range vacuum sensor.
Gas Delivery System:
• 2 or 3 gas supply lines with automated mass flow controllers (MFCs) (flow rate up to 50 sccm).
Process Modules:
• Two RF magnetron sputtering sources (ORBIS2-RF) with automatic shutters;
• Inductively coupled plasma source (Mollis-ICP);
• Rotating substrate holder with RF bias (CARRIER-CCP);
• Quartz crystal thickness monitor (PIEZO-01).
Dimensions: 750х650х750 mm.
VTE IGNIS-A - Technological devices
ORBIS2-RF
RF Magnetron Sputtering System
Operating frequency: 13.56 MHz
RF power: 300 W
Target diameter: 50 mm
Mollis ICP
Inductively coupled plasma (ICP) source
Operating frequency : 13.56 MHz
Working power: 300 W
Plasma concentration ne: 10E11 – 10E13 cm-3
CARRIER-CCP
RF Biased Substrate Holder
Holder diameter: 150 mm
RF Bias Power: 5-150W
Heating power: Up to 1000 W
Max supported temperature: up to 300 oC
Max rotation speed: 90 rpm
PIEZO-01
Automatic quartz control system for coating thickness and growth rate during deposition.
Allows you to monitor the growth rate and thickness of the deposited coating with an accuracy of up to 1 nm.